Solder Paste 183° MECHANIC XGSP50 42g | Etech-Parts
zoom_out_map
chevron_left chevron_right

Solder paste 183° MECHANIC XGSP50 (42g)

Product Description:
100% new and high quality!!
Rosin flux is used to facilitate soldering.
It cleans and prevents oxidation of metals, which allows the solder to create solid and durable mechanical and electrical bonds.
It also acts as a wetting agent, increasing solder flow and the efficiency of the soldering process.
Perfect for mobile phones, PC boards and other sophisticated chip-level soldering.
Features:
Product: BST-21503A
Melting point: 60 ℃
Weight: 40 g / pc

Description

The Solder Paste 183° MECHANIC XGSP50 (42g) is used for soldering work that requires a precise melting temperature. It ensures a strong and durable bond between electronic components. Reference: OX830.

Features

  • Melting temperature: 183°C
  • Weight: 42g
  • Brand: MECHANIC
  • Reference: OX830

Workshop Use

Ideal for electronic repairs requiring precise soldering. Used to assemble components on printed circuit boards.

Frequently Asked Questions

What is the purpose of the melting temperature of 183°C?

It allows for effective soldering without damaging sensitive components.

Is the paste compatible with all types of metals?

It is primarily used for standard electronic soldering.

How should solder paste be stored?

Store it in a cool, dry place to maintain its properties.

Data sheet
MECHANIC
OX830
8771621657950