Buy RELIFE HW21S Solder Paste Lead Silver High-Quality for Precision Soldering
zoom_out_map
chevron_left chevron_right
NewOut-of-Stock

Solder Paste Containing Lead and Silver RELIFE HW21S

Key Features of RELIFE HW21S Solder Paste Containing Lead and Silver:

  1. High-Quality Composition: RELIFE HW21S is formulated with a premium blend of lead and silver, ensuring exceptional solder joint reliability and excellent thermal conductivity for demanding electronic applications.

  2. Optimal Melting Point: Designed for efficient soldering tasks, this paste offers a controlled melting range, enhancing precision in reflow and manual soldering processes, which is crucial for intricate PCB work.

  3. Superior Wettability: Experience excellent wettability on a variety of substrates, facilitating smooth and consistent flow to create robust, corrosion-resistant solder joints.

  4. Fine Particle Size: The consistent and fine particle distribution allows for precise application, even in the most detailed electronic assemblies, contributing to high-quality finish and performance.

  5. Long Stencil Life: Offers extended stencil life with stable viscosity over time, which supports production efficiency by reducing the number of stencil cleanings required.

  6. Enhanced Adhesion: Superior adhesion properties offer strong bonding of components to the circuit board, which helps in minimizing movement during high-temperature soldering operations.

  7. Lead and Silver Benefits: Incorporating lead provides ease of use with lower melting temperatures, while silver adds strength to the connections and improves electrical conductivity, effectively supporting high-frequency applications.

  8. Versatile Usage: Ideal for both automated and manual soldering, this solder paste is suitable for a wide range of electronic components and surface mount devices, catering to diverse industry needs.

  9. RoHS Compliance: While containing lead, this paste offers RoHS-compliant options for specific applications requiring lead-based solders, supporting environmental and safety standards

Description

Product Description: RELIFE HW21S Solder Paste Containing Lead and Silver


Introducing RELIFE HW21S Solder Paste - Precision in Every Joint

Elevate your soldering projects with the RELIFE HW21S Solder Paste, a premium solution combining lead and silver to offer superior conductivity and reliability. This high-performance solder paste is meticulously crafted to meet the demands of both professionals and hobbyists who seek precision and excellence in every solder joint.


Key Benefits:

  1. Exceptional Conductivity: The unique blend of lead and silver ensures that each connection provides superior electrical and thermal conductivity, enhancing the efficiency and durability of your circuits.

  2. Smooth Application: RELIFE HW21S boasts a smooth consistency that ensures even application, reducing the risk of solder bridges and providing a clean, professional finish.

  3. Reliable Performance: Designed for high reliability, this solder paste is perfect for use in environments where consistent performance and long-term durability are critical.


Technical Specifications:

  • Composition: Lead (Pb) and Silver (Ag)
  • Melting Point: 183°C - 190°C
  • Viscosity: Medium viscosity, ideal for a variety of applications from fine-pitch to high-mass components
  • Packaging: Secure, resealable container to maintain product integrity

Compatibility:

The RELIFE HW21S Solder Paste is compatible with a wide range of electronic components and PCB types. Perfect for:

  • Consumer Electronics
  • Automotive Circuits
  • Telecommunications Equipment
  • Industrial Control Boards

Recommended Use:

This solder paste is ideal for applications that require a robust connection in demanding conditions. It is particularly suited for:

  • SMT (Surface-Mount Technology)
  • Through-Hole Soldering
  • PCB Repairs and Prototyping

Installation Instructions:

  1. Preparation: Ensure all surfaces to be soldered are clean and free from oxidation or contaminants.

  2. Application: Apply the solder paste to the designated areas using a squeegee or stencil.

  3. Soldering: Heat carefully using a soldering iron or reflow oven, maintaining the ideal temperature to avoid overheating.

  4. Cooling: Allow soldered joints to cool naturally to room temperature.

  5. Cleaning: Post-soldering, any residues can be cleaned using an appropriate solvent to ensure a pristine finish.


Warranty Information:

Enjoy peace of mind with our 12-month warranty on RELIFE HW21S Solder Paste, which ensures you receive a reliable product free from defects in materials and workmanship (warranty does not cover Service Packs).


Whether you're working on complex electronics projects or simple repairs, trust RELIFE HW21S Solder Paste to deliver connections that last. Experience the precision and reliability that comes with a product designed for excellence.

Data sheet
RELIFE
O1674
6941590213415
HW21S